Technical Lead, Package Design Engineering
May 15
🏢 In-office - Bay Area
Description
• Package planning and integration • Package specification and analysis • Bring up, testing, and characterization of interfaces • Analysis of advanced packaging technologies • Specification and analysis of power and signaling requirements • Define and realize thermal management solutions • Support operations team during package qualification and failure analysis
Requirements
• MS or PhD in EE or MechE • 10+ years of experience • Hands-on experience with Cadence APD/SIP • Strong understanding of SI/PI • Mastery of Ansys HFSS and SiWave • Experience with 2.5D packaging and interposer integration
Benefits
• Joining a world-class team of silicon and distributed systems experts • Opportunity to work on groundbreaking new category of products • Solving key infrastructure challenges • Growing in a fast-paced, dynamic startup environment
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