RF/ EM Research Scientist

3 days ago

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HRL Laboratories, LLC

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Innovation with a purpose.

501 - 1000

Description

•Primary responsibility is to simulate electromagnetic performance characteristics of printed circuit boards (PCB) and chip packages then generate and validate equivalent broadband models to explore the design space and predict future performance. •Architect, create, and validate broadband SPICE models for large-element count (100+ signals), high-frequency ( > 1 GHz), high-dynamic-range (-80dB) linear time-invariant (LTI) signal chains. •Collaborate with stakeholders to synthesize model requirements including specifying the model format as well as size and speed constraints. Models must meet accuracy standards in both time- and frequency-domain simulations. •Design pre-layout models for initial design-space explorations, and later import, simulate, and model the resulting device/package/PCB post-layout. •Deploy strategic techniques to simplify the models while retaining accuracy and minimizing simulation time. •Generate test plans to validate your models and coordinate with test engineers to execute the test plans. You will validate your models against measured results and analyze any deltas as feedback for improving the model.

Requirements

•Strong grasp of the math and theory underlying network parameters (S/Y/Z, Transfer, H, ABCD Matrices) and their application to real-world devices and structures •Experience using rational fit, state-space, and other methods for representing frequency-domain behavior in a time-domain simulation, and model order reduction techniques for streamlining performance •Aware of limitations inherent in modeling techniques (e.g. convergence criteria, low-frequency accuracy, process variations) and potential mitigations (Monte Carlo and corner case simulation, partitioning, modifying the relative convergence tolerance etc.) •Matlab scripting •Understanding of the basic methodology of MoM, FEM, and FDTD simulation tools •Demonstrated experience using any of the following simulation software (e.g. Ansys HFSS or HFSS 3D Layout, SIwave, Q2D/Q3D, Maxwell, Cadence ADE, APD, EMX, Clarity 3D, AWR, Sonnet 3D Planar, CST Studio Suite; IdEM, Keysight ADS Momentum, COMSOL AC/DC, RF) •Experience using Power Integrity Tools (e.g. Mentor Graphics Hyperlynx PI, Ansys SIwave, CST Studio Suite AC/DC, Cadence Sigrity PowerPI) •Experience using Signal Integrity Tools (e.g. Hyperlynx SI, Ansys SIwave, CST Studio Suite RF, Cadence Sigrity PowerSI) •Familiar with PCB schematics, layout, design constraints, impedance control, et. al.