Principal Engineer - 2.5D/3D Process Development
March 16
🏢 In-office - Bay Area
Description
• Drive company’s AI products from concept to high volume manufacturing • Manage and drive assembly process technology development in partnership with foundries and OSATs • Hands-on experience in TSV and wafer process development, 2.5D/3D CoW assembly • Lead TSV, backend stack development and bring packaging solutions from concept to prototypes • Manage qualification of packages, ideation, and innovation of advanced package solutions • Actively manage internal and external resources towards corporate milestones • Communicate technical and project status at the executive level
Requirements
• 15+ years of experience in Semiconductor Packaging, Process and Technology Development • Expertise in advanced packaging technologies and bringing products from development to high volume manufacturing • Familiarity with component & system level reliability, testing, and FA • M.S or Ph.D. in Mechanical Engineering, Materials Science or Physics is required • Located in Bay area • Experience in project management and photonics packaging preferred
Benefits
• Competitive base salary • Generous grant of early-stage equity • Great benefits including health, vision, dental, and life insurance • Collaborative and continuous learning work environment
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