Process Integration Engineer
August 28
🏢 In-office - Los Angeles
Description
• Lead the fabrication and process development of novel semiconductor and superconducting devices • Build new process integrations for prototype devices intended to operate at cryogenic temperatures • Develop integrated process flows and design experiments for unit processing steps • Manage WIP, including product lots and parallel process development efforts • Work closely with engineers to design novel devices and perform fabrication experiments • Analyze metrology and electrical test data, feeding back to process improvements • Troubleshoot and resolve process excursions and define integration solutions • Written and oral communications providing status updates for program office and customer
Requirements
• 5-10 years’ experience in processing of semiconductor devices and circuits in R&D environment • Experience with materials and devices operating at cryogenic temperatures, superconductors, and rf engineering strongly preferred • Proven track record of developing solutions to process development for FEOL or BEOL transistor and IC integration • Experience with developing novel unit processes in lithography, RIE/ICP etching, CMP, PVD, PECVD deposition • Experience with developing metrology plans for CD-SEM, ellipsometry, and other in-line techniques • Experience interacting with test engineers and device modelers towards iterative process and yield improvements • Experience with statistical analysis in standard software (e.g. python, JMP, etc.
Benefits
• Bonus • Benefits
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