Advanced Packaging and Integration Engineer
April 9
🏢 In-office - Los Angeles
Description
• Lead innovation and development of novel 2.5D and 3D semiconductor integration processes • Organize and manage research and development projects • Develop and maintain relationships with vendors and partner organizations • Present results in written reports, journal papers, and oral presentations • Lead proposal and marketing efforts to sustain R&D • Proficiency in use of computers, engineering work stations, and complex electronic equipment
Requirements
• B.S. degree in Electrical Engineering, Physics, or related scientific discipline. M.S. preferred • More than 5 years of experience in semiconductor manufacturing processes and electronics packaging • Several years of experience in organizing and leading technical research and development efforts • Deep understanding of material science, semiconductor physics, and thermal/mechanical theory • Familiarity with high-speed electrical characterization methods
Benefits
• Base salary range $120,715 - $150,895 • Bonus • Full benefits package
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